This inventor holds 3 USPTO granted patents. Top assignee: Hutchinson Technology Corporation. Active years: 1987-1991.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1987-1991
Title: The Innovative Contributions of John M. Hokanson
Introduction
John M. Hokanson is a notable inventor based in Hutchinson, MN (US), recognized for his contributions to microelectronic technology. With a total of 3 patents, he has made significant advancements in the field of interconnect technology.
Latest Patents
Hokanson's latest patents include a micro-cable interconnect, which features a single exterior flexible insulative coating that contains a plurality of terminally prepared, precisely spaced conductors. These conductors are arranged to match the spacing and pitch of interconnect zones connected to integrated circuits or connectors. Additionally, he has developed an apparatus for aligning wires to solder pads, which includes a wire guide device that ensures precise positioning of fine wires for soldering.
Career Highlights
Hokanson has spent a significant portion of his career at Hutchinson Technology Corporation, where he has been instrumental in developing innovative solutions for microelectronic components. His work has contributed to the advancement of technology in the industry.
Collaborations
Throughout his career, Hokanson has collaborated with talented individuals such as David A. Ziegler and Daniel J. Klima, further enhancing the innovative environment at Hutchinson Technology Corporation.
Conclusion
John M. Hokanson's contributions to microelectronic technology through his patents and collaborative efforts highlight his role as a key innovator in the field. His work continues to influence advancements in interconnect technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile