Hutchinson Technology Corporation

John M Hokanson

Hans Alois Mische

David A Ziegler

Daniel J Klima

Ronald Weispfenning

Wallace J Devries

Steven P Mertens

Terrence G Field

Kenneth S Bentz

A micro-cable interconnect comprises a single exterior flexible insulative coating internally containing a plurality of terminally prepared, precisely spaced conductors. The conductors are arranged with a spacing and pitch to identically match spacing and pitch of interconnect zones operatively connected to an integrated circuit or connector, with the conductors constructed and arranged for bonding to the interconnect zones. A method of forming a micro-cable interconnect comprises the steps of:

Micro-cable interconnect

A wire guide device includes a base fixture to which a microelectronic component is fixedly attached such that solder pads on the component are exposed. A lacette consisting of a plurality of spaced, upstanding posts is positioned adjacent the microelectronic component such that the posts are aligned with the solder pads. Fine wire is directed around the posts over the solder pads to a wire guide. The wire guide holds each laced wire in position for soldering.

Apparatus for aligning wires to solder pads

Fine wires are soldered without flux to solder pads on a flexible circuit of a workpiece by a laser. The laser beam is aligned and moved over the solder pad to describe a rectangle by movement of mirrors on a programmed, motor driven X-Y-Z linear table. Wires are deeply sunk into the solder pads by the weight of a cone brought against the wire carried by the X-Y-Z table. Vaporized insulation is restrained within the cone to maintain a clean microelectronic workpiece.

Laser soldering apparatus and method

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Hutchinson, MN, United States of America

John M Hokanson