John M Angiulli is a notable inventor based in Lagrangeville, NY (US). He has made significant contributions to the field of technology, particularly in memory packaging and oscillator design. With a total of 4 patents to his name, Angiulli's work has had a considerable impact on the industry.

Latest Patents

Among his latest patents is the "Vertical chip mount memory package and method." This innovative packaging substrate is designed to accommodate memory chip cubes and interconnect chips, utilizing two types of lead tin solder alloys during assembly. The process involves aligning chip pads and reflowing solder to form memory chip pairs, ultimately creating a memory cube that is joined to the packaging substrate. Another significant patent is the "CMOS voltage controlled ring oscillator." This variable frequency digital ring oscillator is compact and efficient, employing CMOS technology to achieve a wide range of oscillation frequencies controlled by DC voltages. The design allows for a small number of components while maintaining high performance.

Career Highlights

John M Angiulli is currently associated with International Business Machines Corporation (IBM), where he continues to innovate and contribute to advancements in technology. His work has been instrumental in developing solutions that enhance the functionality and efficiency of electronic devices.

Collaborations

Throughout his career, Angiulli has collaborated with esteemed colleagues, including Richard R Konian and Leon L Wu. These partnerships have fostered a creative environment that has led to groundbreaking innovations in their respective fields.

Conclusion

John M Angiulli's contributions to memory packaging and oscillator technology exemplify his dedication to innovation. His patents reflect a commitment to advancing technology and improving electronic systems.