Highland, NY, United States of America

John J Moore

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2012-2013.


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2012-2013

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2 patents (USPTO):Explore Patents

Title: John J Moore: Innovator in Semiconductor Technology

Introduction

John J Moore is a notable inventor based in Highland, NY (US). He has made significant contributions to the field of semiconductor technology, particularly in dynamic random access memory (DRAM) devices. With a total of 2 patents, his work has had a considerable impact on the industry.

Latest Patents

One of John J Moore's latest patents is a technique to create a buried plate in embedded dynamic random access memory devices. This method involves forming a trench structure in a semiconductor substrate and exposing the sidewalls of the trench to an arsenic-containing gas. This process allows for the adsorption of an arsenic-containing layer on the sidewalls of the trench. Subsequently, a material layer is deposited on the sidewalls to encapsulate the arsenic-containing layer between the material layer and the trench sidewalls. This innovative approach enhances the performance and efficiency of DRAM devices.

Career Highlights

John J Moore is currently employed at International Business Machines Corporation, commonly known as IBM. His role at IBM has allowed him to work on cutting-edge technologies and contribute to advancements in semiconductor design and manufacturing.

Collaborations

Throughout his career, John has collaborated with several talented individuals, including Ashima B Chakravarti and Jacob B Dadson. These collaborations have fostered innovation and have been instrumental in the development of new technologies in the semiconductor field.

Conclusion

John J Moore is a distinguished inventor whose work in semiconductor technology has led to significant advancements in DRAM devices. His innovative techniques and collaborations continue to shape the future of the industry.

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