This inventor holds 2 USPTO granted patents. Top assignee: Washington University. Active years: 2018-2019.
Company Filing History:
Years Active: 2018-2019
Title: John J Boyle: Innovator in Deformation Quantification
Introduction
John J Boyle is a notable inventor based in St. Louis, MO (US). He has made significant contributions to the field of deformation quantification through his innovative methods and systems. With a total of 2 patents, Boyle's work is recognized for its impact on technology and research.
Latest Patents
Boyle's latest patents include a system and method for quantifying deformation, disruption, and development in a sample. This computer-implemented method utilizes a device in communication with a memory to determine the quantification of deformation. The process involves receiving two images of the sample and registering them using a warping function. This function maps pixels from the first image to the second, allowing for the determination of a displacement field. Ultimately, a quantification of the deformation is derived based on this displacement field.
Career Highlights
John J Boyle is affiliated with Washington University, where he continues to advance his research and innovations. His work is characterized by a strong focus on practical applications of technology in understanding material properties and behaviors.
Collaborations
Boyle has collaborated with esteemed colleagues such as Guy M Genin and Maiko Kume. These partnerships have further enriched his research and contributed to the development of his patented technologies.
Conclusion
John J Boyle stands out as an influential inventor in the realm of deformation quantification. His innovative methods and dedication to research continue to shape advancements in technology.