Highland, NY, United States of America

John F Vetrero


Average Co-Inventor Count = 6.6

ph-index = 2

Forward Citations = 27(Granted Patents)


Location History:

  • Highland, NY (US) (2002)
  • Marlboro, NY (US) (2004 - 2005)

Company Filing History:


Years Active: 2002-2005

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3 patents (USPTO):Explore Patents

Title: A Comprehensive Overview of Inventor John F. Vetrero

Introduction

John F. Vetrero, based in Highland, NY, is an accomplished inventor with a notable portfolio of three patents. His innovations have significantly contributed to advancements in technology, particularly in electrical engineering and chip carrier modules.

Latest Patents

One of John F. Vetrero's latest patents is a jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules. This innovative structure facilitates the translation of wiring connections from points in a first grid to corresponding points in a second grid in a chip carrier module. The design encompasses a first translation layer that is connected to the first grid, translating it along the x-axis. Additionally, a second translation layer is linked to the first layer, translating the wiring connections from the first grid in the orthogonal y-axis direction, which is also connected to the second grid. This dual-layer translation structure enhances the efficiency of wiring configurations in chip carrier modules.

Career Highlights

John F. Vetrero's career is marked by his work with the International Business Machines Corporation (IBM), where he has been able to apply his inventive skills in a corporate setting, furthering research and development in technology.

Collaborations

Throughout his career, John has collaborated with notable coworkers, including Glenn Graham Daves and Jason Lee Frankel. Their teamwork and combined expertise have helped drive innovative solutions within their projects at IBM.

Conclusion

In conclusion, John F. Vetrero stands out as a prominent figure in the field of inventions, with a strong focus on technology and chip carrier modules. His contributions through patents and collaborations continue to inspire innovation in the industry.

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