John E Will

Title: John E Will: Innovator in EMI Containment Technologies

Introduction

John E Will is a notable inventor based in Pleasanton, CA (US). He has made significant contributions to the field of integrated circuit packaging, particularly in the area of electromagnetic interference (EMI) containment. With a total of 2 patents, his work has been instrumental in advancing technology in this domain.

Latest Patents

John E Will's latest patents include innovative designs for EMI grounding pins for CPU/ASIC chips. This integrated circuit package features EMI containment attributes that enhance performance and reliability. The design incorporates a plurality of pins on a substrate, which may form a peripheral row in an array. These pins serve to couple the lid of the package to at least one ground plane of a circuit board. Another significant patent is for an integrated circuit package that comprises EMI containment features. This package includes both a first and a second EMI containment configuration, with the latter surrounding the former. Both configurations are designed with vias that connect to at least one ground plane of the integrated circuit package.

Career Highlights

John E Will is currently employed at Sun Microsystems, Inc., where he continues to innovate and develop cutting-edge technologies. His work has had a lasting impact on the industry, particularly in improving the performance of integrated circuits.

Collaborations

Throughout his career, John has collaborated with talented individuals such as Sergiu Radu and David Hockanson. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

John E Will is a distinguished inventor whose contributions to EMI containment technologies have significantly advanced the field of integrated circuit packaging. His innovative patents and collaborations reflect his commitment to excellence in technology.