The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2005
Filed:
Jan. 15, 2003
Applicants:
Sergiu Radu, Fremont, CA (US);
Bidyut K. Sen, Milpitas, CA (US);
David Hockanson, Boulder Creek, CA (US);
John E. Will, Pleasanton, CA (US);
Inventors:
Sergiu Radu, Fremont, CA (US);
Bidyut K. Sen, Milpitas, CA (US);
David Hockanson, Boulder Creek, CA (US);
John E. Will, Pleasanton, CA (US);
Assignee:
Sun Microsystems, Inc., Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/12 ; H01L023/06 ; H01L023/52 ;
U.S. Cl.
CPC ...
Abstract
An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a peripheral row of pins in an array of pins. The pins may couple a lid of the package to at least one ground plane of a circuit board.