John De Nuto

Title: Innovations by John De Nuto

Introduction

John De Nuto is an accomplished inventor based in Warren, Ohio. He has made significant contributions to the field of flexible circuit technology. His innovative approach has led to the development of a unique patent that enhances electrical connections in multi-layer circuits.

Latest Patents

John De Nuto holds a patent for a "Layer to layer interconnect." This invention includes stacked flexible circuit layers featuring raised features or bumps for Z-axis interconnection to another circuit layer or electrical component. The design incorporates an intermediate or adhesive layer that separates each circuit layer. The multiple layers are aligned so that the raised features from one layer connect with pads of an adjacent layer. This innovative design allows for blind vias to be created without the need for pre-drilling, enhancing the efficiency of circuit assembly.

Career Highlights

John De Nuto is currently employed at Packard Hughes Interconnect Company. His work focuses on advancing flexible circuit technology, which is crucial for modern electronic devices. His patent reflects his commitment to improving electrical connectivity and reliability in complex circuit designs.

Collaborations

Throughout his career, John has collaborated with notable colleagues, including William R. Crumly and Haim Feigenbaum. These partnerships have contributed to the development of innovative solutions in the field of interconnect technology.

Conclusion

John De Nuto's contributions to flexible circuit technology exemplify the spirit of innovation. His patent for layer-to-layer interconnects showcases his ability to solve complex engineering challenges. His work continues to influence the advancement of electronic connectivity solutions.