Colorado Springs, CO, United States of America

John Connor

This inventor holds 1 USPTO granted patent. Top assignee: Avago Technologies General IP (Singapore) Pte. Ltd.. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John Connor. Retrieved from https://idiyas.com/inventor/john-connor-xnm0678o

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: John Connor: Innovator in Laminate Interconnect Technology

Introduction

John Connor is a notable inventor based in Colorado Springs, CO (US). He has made significant contributions to the field of laminate interconnect technology. With a focus on innovative designs, Connor has developed a unique patent that enhances the functionality of electronic components.

Latest Patents

Connor holds a patent for a "Laminate interconnect having a coaxial via structure." This invention features a laminate interconnect structure that includes a core material and at least one additional layer adjacent to the core material. It incorporates a first electrically conductive via formed in the core material and a second electrically conductive via that is coaxial with the first, separated by a non-conductive material. This design improves the efficiency and reliability of electronic connections.

Career Highlights

Connor is currently employed at Avago Technologies General IP (Singapore) Pte. Ltd., where he continues to innovate in the field of electronic interconnects. His work has been instrumental in advancing the technology used in various electronic devices.

Collaborations

Some of his notable coworkers include Adam Gallegos and Mark A Hinton, who contribute to the collaborative environment that fosters innovation at Avago Technologies.

Conclusion

John Connor's contributions to laminate interconnect technology exemplify the spirit of innovation in the electronics industry. His patent and ongoing work continue to influence the development of more efficient electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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