The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Nov. 02, 2011
Applicants:

Adam Gallegos, Fort Collins, CO (US);

Mark Hinton, Fort Collins, CO (US);

Nurwati Suwendi Devnani, Fort Collins, CO (US);

John Connor, Colorado Springs, CO (US);

Inventors:

Adam Gallegos, Fort Collins, CO (US);

Mark Hinton, Fort Collins, CO (US);

Nurwati Suwendi Devnani, Fort Collins, CO (US);

John Connor, Colorado Springs, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H05K 1/02 (2006.01); H01L 21/48 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15311 (2013.01); H05K 1/0222 (2013.01); H05K 1/0245 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09809 (2013.01); H01L 23/49816 (2013.01); H01L 21/486 (2013.01); H01L 24/16 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/29099 (2013.01); H01L 2224/131 (2013.01); H01L 2224/32245 (2013.01);
Abstract

A laminate interconnect structure includes a core material and at least one additional layer adjacent the core material, a first electrically conductive via formed in the core material, and a second electrically conductive via formed in the core material, coaxial with the first electrically conductive via and separated from the first electrically conductive via by a non-conductive material.


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