John Carlo C Molina

Title: John Carlo C Molina: Innovator in Microelectronics

Introduction

John Carlo C Molina is an inventor based in Limay, Philippines. He is known for his contributions to the field of microelectronics, particularly in semiconductor packaging. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

Molina's recent patent applications include the following:

1. **Microelectronic Package with Raised Connector for External Component** - This semiconductor package is designed to electrically connect an external component to its top surface. It features a raised connector that extends from a lead frame portion, vertically through encapsulation material, and is exposed at the top surface. The raised connector consists of a vertical column and a horizontal pad, both of which are electrically conductive. The design allows for multiple raised connectors to be attached to the lead frame portion.

2. **Packages with Notched, Interdigitated, and Retracted Metal Layers** - This application describes a package that includes a semiconductor die with circuitry. The package features a substrate with first and second metal layers, where the first layer is closer to the device side. The top surface of at least one metal layer includes a notch, and the package is covered with a mold compound. The design aims to enhance the functionality and efficiency of semiconductor devices.

Conclusion

John Carlo C Molina is an emerging inventor in the microelectronics sector, showcasing innovative ideas through his latest patent applications. His work has the potential to contribute significantly to advancements in semiconductor technology.