The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Dec. 28, 2022
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

John Carlo C. Molina, Limay, PH;

Connie A. Esteron, Mabalacat, PH;

Ruby Ann M. Camenforte, Pampanga, PH;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/6836 (2013.01); H01L 23/3107 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/97 (2013.01); H01L 25/16 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49176 (2013.01); H01L 2224/97 (2013.01);
Abstract

In some examples, a method for manufacturing a semiconductor package comprises coupling first and second semiconductor dies to a metal frame; covering the first and second semiconductor dies and the metal frame with a mold compound; coupling first and second passive components to the first and second semiconductor dies, the first and second passive components on an external surface of the mold compound; sawing through a portion of the metal frame from a first direction to form a first vertical surface of the metal frame, the first vertical surface having a first roughness due to the sawing; and laser cutting through the mold compound and a remainder of the metal frame from a second direction opposing the first direction to form a second vertical surface on the metal frame and a third vertical surface on the mold compound, the second vertical surface having a second roughness due to the laser cutting and the third vertical surface having a third roughness due to the laser cutting.


Find Patent Forward Citations

Molina, John Carlo C.. (2026). Multi-tool and multi-directional package singulation (U.S. Patent No. 12588542). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12588542

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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