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For the Inventor, By the Inventor

Kokomo, IN, United States of America

John A Hearn

USPTO Granted Patents = 9

Average Co-Inventor Count = 3.1

ph-index = 7

Forward Citations = 144(Granted Patents)


Company Filing History:

goldMedal9 out of 788 
 
Delco Electronics Corporation
 patents

Years Active: 1990-1999

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9 patents (USPTO):Explore Patents
1. 5895883 - Apparatus for dampening movement of passivation material in an (1999-04-20),
2. 5492263 - Method for wire bonding an aluminum wire to a lead of an electronics (1996-02-20),
3. 5475567 - Method for hermetically sealing a single layer ceramic thick film (1995-12-12),
4. 5263880 - Wirebond pin-plastic header combination and methods of making and using (1993-11-23),
5. 5233871 - Hybrid accelerometer assembly (1993-08-10),
6. 5176853 - Controlled adhesion conductor (1993-01-05),
7. 5122929 - Method of achieving selective inhibition and control of adhesion in (1992-06-16),
8. 5121298 - Controlled adhesion conductor (1992-06-09),
9. 4959751 - Ceramic hybrid integrated circuit having surface mount device solder (1990-09-25),

Title: **Innovative Contributions of John A. Hearn in Electronics**

Introduction

John A. Hearn, an accomplished inventor based in Kokomo, Indiana, holds an impressive portfolio of nine patents. His contributions primarily focus on advancements in electronic modules, showcasing his expertise in the field of electronics and material science.

Latest Patents

Among Hearn's most recent patents are two notable innovations:

1. **Apparatus for Dampening Movement of Passivation Material in an Electronic Module** - This invention involves a specialized housing that contains an electrical circuit and a non-solid passivation material. The apparatus is designed to limit the movement of the passivation material within the housing in at least one direction, utilizing a dam-like structure.

2. **Method for Wire Bonding an Aluminum Wire to a Lead of an Electronics Package** - This method employs a nickel plating process in conjunction with an ultrasonic bonding process. This combination enhances the bond strength between the aluminum wire and the lead member. Hearn's plating process produces a thicker nickel layer with a smooth microfinish, which further improves the reliability and repeatability of the joint.

Career Highlights

John Hearn's career is closely associated with Delco Electronics Corporation, where he has made significant strides in electronic components and technologies. His innovative approaches have not only contributed to the company's success but have also provided more reliable solutions in the electronics industry.

Collaborations

Throughout his career, Hearn has collaborated with notable colleagues, including Dwight L. Schwarz and Dwadasi H. Sarma. These partnerships have fostered a dynamic environment for innovation, leading to the development of cutting-edge technologies in electronic engineering.

Conclusion

With his extensive experience and innovative mindset, John A. Hearn continues to be a prominent figure in the field of electronics. His latest patents reflect a strong commitment to enhancing the functionality and reliability of electronic devices, solidifying his status as a leading inventor in his industry.

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