Delco Electronics Corporation

John A Hearn

Dwight L Schwarz

Ponnusamy Palanisamy

Dwadasi H Sarma

Mark E Webster

Gregory L Hall

Daniel A Lawlyes

Ronald D Myer

Steven Michael Stansberry

Steven A Middleton

William M Maki

Glen R Puterbaugh

Daniel R Bellus

Jack A Bednarz

Pardeep Kumar Bhatti

An apparatus for dampening movement of passivation material in an electronic module and a method for manufacturing an electronic module incorporating such an apparatus are disclosed. The apparatus includes a housing defining a cavity sized to contain an electrical circuit and a non-solid passivation material. The apparatus further includes means for limiting movement of the passivation material within the cavity in at least one direction. In a preferred embodiment, the limiting means comprises at least one dam.

Apparatus for dampening movement of passivation material in an

A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together cooperate to form a reliable and highly repeatable joint between the wire and the lead member. The ultrasonic bonding process is specifically tailored to the nickel plating produced by the plating process, so as to significantly enhance the bond strength of the resulting ultrasonic bond joint. The plating process is devised to produce a nickel plating which is thicker than that generally practiced, and whose surface is characterized as having a relatively smooth microfinish which unexpectedly serves to enhance the bond strength of the ultrasonic bond joint.

Method for wire bonding an aluminum wire to a lead of an electronics

A method is provided for hermetically sealing a surface-mounted thick film electronic module within a cover soldered to a ceramic substrate, under the circumstances in which the input/output terminals of the electronic module are electrically interconnected with their corresponding external conductors on the exterior of the cover with a number of conductors. The integrity of the hermetic seal is promoted by routing the conductors beneath the ceramic substrate, as opposed to printing the conductors directly on the surface of the ceramic substrate, which necessitates that a dielectric material be placed intermediate the conductors and the bond material so as to electrically isolate the conductors from the bond material and cover. Consequently, an advantage of the present invention is the avoidance of a material mismatch between the dielectric material and the bonding material and the cover.

Method for hermetically sealing a single layer ceramic thick film

Disclosed is a wirebond pin having a star-shaped anchor, collar and paddle. The collar prevents passivation material, used to make a sealed semiconductor device, from leaking out of the package. The collar also helps to eliminate the resonant vibration of the pin during ultrasonic wirebonding at the paddle.

Wirebond pin-plastic header combination and methods of making and using

A microaccelerometer package is provided for use in on-board automotive safety control and navigational systems. The microaccelerometer package is constructed so as to minimize the influence of extraneous mechanical stress and vibrational resonance on the micromachined accelerometer. The microaccelerometer package includes a rigid housing in which there is a cavity for receiving the micromachined accelerometer unit and the signal-processing circuitry. The lower surface of the cavity is interrupted by a recess projecting below the plane of the lower surface. The micromachined accelerometer unit is secured within the recess so as to be below the plane of the lower surface. The signal-processing circuitry is supported by a substrate which is secured to the lower surface of the cavity. One edge of the substrate, on which are disposed a number of wire bond sites, partially projects over the accelerometer unit within the recess, but no further than a corresponding number of wire bond sites on the micromachined accelerometer unit. Electrically interconnecting the wire bond sites of the signal-processing circuitry and the micromachined accelerometer unit are a corresponding number of electrical conductors.

Hybrid accelerometer assembly

Compositions useful for printing controllable adhesion conductive patterns on a printed circuit board include finely divided copper powder, a screening agent and a binder. The binder is designed to provide controllable adhesion of the copper layer formed after sintering to the substrate so that the layer can lift off the substrate in response to thermal stress. Additionally, the binder serves to promote good cohesion between the copper particles to provide good mechanical strength to the copper layer so that it can tolerate lift off without fracture.

Controlled adhesion conductor

A technique for providing controlled adhesion of a portion of a printed conductor to a circuit board employs an inhibitor layer between the circuit board and the portion of the printed conductor where such controlled adhesion is desired. The inhibitor layer is formed using a mixture of finely divided alumina powder and a glass frit, which are both suspended in an organic screening agent. An electrical module connected between controllably adherent conductor portions is thereby able to move to relative mechanical stresses.

Method of achieving selective inhibition and control of adhesion in

A printed circuit board assembly uses a conductive pattern that includes both firmly adherent conductors and controllably adherent conductors. The controllably adhering conductors are free to lift off the printed circuit board to relieve mechanical forces caused by thermal stresses at solder joints between the controllably adherent conductors and integrated circuit chips of the assembly.

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Kokomo, IN, United States of America

John A Hearn