Baltimore, MD, United States of America

Johannes Staguhn

This inventor holds 1 USPTO granted patent. Top assignee: United States of America as Represented by the Administrator of NASA. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Johannes Staguhn. Retrieved from https://idiyas.com/inventor/johannes-staguhn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Johannes Staguhn in Indium Bump Fabrication

Introduction

Johannes Staguhn is an accomplished inventor based in Baltimore, MD (US). He has made significant contributions to the field of semiconductor technology, particularly in the fabrication of indium bumps on non-planar surfaces. His innovative approach has the potential to enhance the performance and reliability of electronic devices.

Latest Patents

Staguhn holds a patent for a method titled "Indium bump fabrication on non-planar surface." This patent describes a process for fabricating indium bumps on a substrate that features a base layer and a second layer. The method involves layering photoresist material on the substrate's surface while ensuring it does not contact the edges of the second layer. Portions of the photoresist are then removed to expose the base layer, followed by the deposition of indium on the uncovered areas. This technique is crucial for improving the efficiency of electronic components.

Career Highlights

Johannes Staguhn is currently employed by the United States of America as Represented by the Administrator of NASA. His work at NASA has allowed him to engage in cutting-edge research and development, contributing to advancements in aerospace technology and materials science.

Collaborations

Staguhn collaborates with various professionals in his field, including his coworker Ari D Brown. Their combined expertise fosters innovation and drives progress in their projects.

Conclusion

Johannes Staguhn's contributions to indium bump fabrication represent a significant advancement in semiconductor technology. His innovative methods and collaboration with esteemed colleagues continue to push the boundaries of what is possible in electronic device manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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