Joeri De Vos

Title: Innovations by Joeri De Vos in Semiconductor Bonding Techniques

Introduction

Joeri De Vos, an accomplished inventor based in Neerwinden, Belgium, has made significant contributions to the field of semiconductor technology. With a total of five patents, he has focused on developing advanced methods for wafer-to-wafer hybrid bonding, which are crucial for the integration of integrated circuit (IC) devices. His innovative approaches not only enhance the efficiency of semiconductor devices but also pave the way for future advancements in the technology.

Latest Patents

Joeri De Vos's latest patents demonstrate his expertise in bonding techniques. His patent titled **"Substrate, assembly and method for wafer-to-wafer hybrid bonding"** outlines a method that involves two substrates with metal contact structures isolated by a dielectric bonding layer. The method introduces openings in the bonding layer, allowing for conductive material to be deposited and creating recessed contact patches. By aligning and bonding the substrates with an annealing step, his innovation effectively establishes conductive connections.

Another notable patent, **"Method for bonding and interconnecting integrated circuit devices,"** describes a procedure for bonding multiple IC devices on silicon wafers. This method employs direct bonding to form a robust wafer assembly, incorporating features like cavities and Through Semiconductor Vias (TSVs). The integration of isolation liners ensures that the devices remain effectively connected while preventing interference from semiconductor materials.

Career Highlights

Throughout his career, Joeri De Vos has worked with esteemed research institutions, notably Imec and Imec Vzw, making substantial contributions to the semiconductor sector. His work has been instrumental in developing technologies that enhance the performance and reliability of electronic devices.

Collaborations

Joeri's efforts in the field have been further supported by collaborations with colleagues such as Eric Beyne and Koen De Munck. These partnerships have fostered an environment of innovation and knowledge sharing, which is essential in the rapidly evolving landscape of semiconductor technologies.

Conclusion

Joeri De Vos stands out as a prominent inventor in semiconductor bonding techniques, with a portfolio of patents that highlight his commitment to innovation. His advancements in wafer-to-wafer hybrid bonding and IC device interconnection methods are set to have a lasting impact on the industry, paving the way for more powerful and efficient electronic devices in the future.