The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Feb. 27, 2015
Applicants:
Imec Vzw, Leuven, BE;
Globalfoundries Inc., Grand Cayman, CA;
Inventors:
Eric Beyne, Leuven, BE;
Joeri De Vos, Neerwinden, BE;
Jaber Derakhshandeh, Leuven, BE;
Luke England, Saratoga Springs, NY (US);
George Vakanas, Tempe, AZ (US);
Assignees:
IMEC VZW, Leuven, BE;
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01); C23C 30/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C23C 30/00 (2013.01); H01L 24/05 (2013.01); H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 2224/031 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04073 (2013.01); H01L 2224/0518 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05149 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05157 (2013.01); H01L 2224/05563 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05657 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48655 (2013.01); H01L 2224/48657 (2013.01); H01L 2224/48755 (2013.01); H01L 2224/48757 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/48857 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/81457 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85355 (2013.01); H01L 2224/85375 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/85457 (2013.01); Y10T 428/1291 (2015.01); Y10T 428/12826 (2015.01); Y10T 428/12861 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/24917 (2015.01);
Abstract
The invention relates to a substrate having at least one main surface comprising at least one non-noble metallic bonding landing pad covered by a capping layer thereby shielding the non-noble metallic bonding landing pad from the environment. This capping layer comprises an alloy, the alloy being NiB or CoB and containing an atomic concentration percentage of boron in the range of 10% to 50%.