Company Filing History:
Years Active: 2015-2020
Title: Joerg Sander: Innovator in Electronic Cooling Technologies
Introduction
Joerg Sander is a notable inventor based in Ulm, Germany. He has made significant contributions to the field of electronic cooling technologies, holding a total of 3 patents. His innovative approaches have the potential to enhance the efficiency and performance of electronic assemblies.
Latest Patents
One of Joerg Sander's latest patents is an "Apparatus and method for cooling an electronic assembly." This apparatus is designed to cool electronic components by utilizing an evaporator that evaporates a cooling medium using the heat generated by the electronic assembly. The power transformer within the apparatus transforms energy stored in the evaporated cooling medium into electric power. The cooling medium operates within an evaporating temperature range of 50°C to 80°C at atmospheric pressure. Another significant patent is the "Method for producing a component," which focuses on manufacturing components with increased thermal conductivity through a layer-by-layer construction process. This method involves applying a layer section of a composite material, which includes metal or metal alloy and highly heat-conducting particles like diamond or cubic boron nitride, onto a base layer.
Career Highlights
Throughout his career, Joerg Sander has worked with prominent companies such as EADS Deutschland GmbH and Hensoldt Sensors GmbH. His experience in these organizations has allowed him to develop and refine his innovative ideas in electronic cooling technologies.
Collaborations
Joerg has collaborated with notable professionals in his field, including Erhard Brandl and Achim Schoberth. These collaborations have contributed to the advancement of his projects and patents.
Conclusion
Joerg Sander's work in electronic cooling technologies showcases his innovative spirit and dedication to improving electronic assembly performance. His patents reflect a commitment to advancing the field and addressing the challenges associated with thermal management in electronics.