Eads Deutschland Gmbh

Hensoldt Sensors Gmbh

Joerg Sander

Ulrich Prechtel

Heinz-Peter Feldle

Erhard Brandl

Achim Schoberth

Tim Moser

Bernhardt Schoenlinner

An apparatus configured to cool an electronic assembly includes an evaporator configured to evaporate a cooling medium using heat of the electronic assembly, and a power transformer configured to transform energy stored in the evaporated cooling medium into electric power. The cooling medium has an evaporating temperature at atmospheric pressure within a temperature range of 50&#xb0; C. to 80&#xb0; C.

Apparatus and method for cooling an electronic assembly

A method for manufacturing a component having increased thermal conductivity through layer-by-layer construction. At least one section of the component is constructed by applying a layer section having predetermined dimensions of a composite material of a metal and/or a metal alloy and particles of a highly heat-conducting material, including diamond and/or cubic boron nitride, in a predetermined area on a base layer by melting the metal or the metal alloy a heat source, in such a way that the metal and/or metal alloy form(s) within the predetermined dimensions a cohesive matrix, in which particles of the highly heat-conducting material are embedded, and then cooling.

Method for producing a component

A hermetically sealed HF front end (e.g. a transmission/reception module) in a multilayer structure that includes electronic components is provided. The multilayer structure contains a plurality of substrates stacked one above the other and carrying the components. Grooves are formed in the substrates and sealing elements are provided between the substrates, which sealing elements engage in the grooves, and the substrates are soldered together.

Hermetically sealed radio-frequency front end

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Ulm, Germany

Joerg Sander