The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Sep. 18, 2010
Applicants:
Heinz-peter Feldle, Senden, DE;
Bernhardt Schoenlinner, Sauerlach, DE;
Ulrich Prechtel, Munich, DE;
Joerg Sander, Ulm, DE;
Inventors:
Heinz-Peter Feldle, Senden, DE;
Bernhardt Schoenlinner, Sauerlach, DE;
Ulrich Prechtel, Munich, DE;
Joerg Sander, Ulm, DE;
Assignee:
EADS Deutschland GmbH, Ottobrunn, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/16 (2006.01); G01S 7/03 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
G01S 7/032 (2013.01); H01L 23/10 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A hermetically sealed HF front end (e.g. a transmission/reception module) in a multilayer structure that includes electronic components is provided. The multilayer structure contains a plurality of substrates stacked one above the other and carrying the components. Grooves are formed in the substrates and sealing elements are provided between the substrates, which sealing elements engage in the grooves, and the substrates are soldered together.