Joel J Orona

Title: Innovations of Joel J Orona

Introduction

Joel J Orona is an accomplished inventor based in San Jose, CA. He has made significant contributions to the field of integrated circuit testing, holding a total of 2 patents. His work focuses on developing innovative methods for diagnosing failures in electronic devices.

Latest Patents

One of Joel's latest patents is titled "Structure and method of testing failed or returned die to determine failure location and type." This invention outlines a structure and method for testing a failed integrated circuit device. It includes a ball grid array substrate with its heat sink removed to create a cavity for placing a failed bare die. An adhesive tape is attached to the lower surface of the substrate, covering the cavity, allowing the die to be placed against the sticky side of the tape. Wire bonds are formed from necessary pads on the die to electrical conductors on the substrate, and the bond wires are covered with epoxy. Once the epoxy is cured, the adhesive tape is removed, exposing the back side of the die for visual inspection while under test.

Career Highlights

Joel J Orona is currently employed at Xilinx, Inc., where he continues to innovate in the field of integrated circuits. His expertise in testing methods has positioned him as a valuable asset to his team and the company.

Collaborations

Throughout his career, Joel has collaborated with notable coworkers such as S Gabriel R Dosdos and Daniel C Nuez. These collaborations have further enhanced his work and contributed to the success of his projects.

Conclusion

Joel J Orona's contributions to the field of integrated circuit testing demonstrate his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving diagnostic methods, making him a noteworthy inventor in his field.