The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2002
Filed:
Jan. 15, 1999
S. Gabriel R. Dosdos, San Jose, CA (US);
Joel J. Orona, San Jose, CA (US);
Daniel C. Nuez, San Jose, CA (US);
Xilinx, Inc., San Jose, CA (US);
Abstract
A structure and method for testing a failed integrated circuit device includes a ball grid array substrate with its heat sink removed to form a cavity where a failed bare die is to be placed. An adhesive tape is attached to the lower surface of the ball grid array substrate covering the cavity, and the die is placed into the cavity against the sticky side of the adhesive tape. Wire bonds are formed from necessary pads on the die to electrical conductors on the substrate and the cavity and bond wires are covered with epoxy. When the epoxy is cured, the adhesive tape is removed, thus exposing the back side of the die for visual inspection while under test.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile