Location History:
- Taichung County, TW (2009)
- Taichung, TW (2011)
Company Filing History:
1 out of 34 
1 out of 1 Years Active: 2009-2011
Title: Innovator Spotlight: Jiung-Yue Tien
Introduction
Jiung-Yue Tien, an accomplished inventor based in Taichung, Taiwan, holds two patents that showcase his expertise in microphone packaging and micro electro-mechanical systems (MEMS). His innovative designs are pivotal in advancing the technology behind sound processing and device integration.
Latest Patents
1. **Package structure of a microphone**: This patent describes a microphone package structure that includes at least a substrate, a sound processing unit, and an upper cap, among other devices. It features a trench on the substrate, maintaining a separation gap between the trench and the bonding pad to prevent short circuits caused by overflowing connective paste during assembly.
2. **Cap package for micro electro-mechanical system (MEMS)**: This patent involves a cap package designed for MEMS devices. It comprises a substrate with a grounded connection zone, a chip mounted on the substrate, and a cap featuring a through hole that aligns with the chip. It incorporates a conducting glue made from a non-metal material, ensuring efficient electrical connectivity between the cap and substrate.
Career Highlights
Jiung-Yue Tien has made significant contributions through his work with Lingsen Precision Industries Ltd. His career in the technology sector has been marked by innovative developments that push the boundaries of conventional designs in audio and micro-device applications.
Collaborations
Throughout his career, Jiung-Yue has collaborated with notable colleagues, including Chin-Ching Huang and Hsi-Chen Yang. Their teamwork and shared vision in advancing technology have undoubtedly enriched their respective projects and patents.
Conclusion
Jiung-Yue Tien’s inventive spirit and dedication to enhancing technology through his patented innovations highlight the importance of continuous improvement in engineering and design. His work not only contributes to the field of audio technology but also opens avenues for future advancements in MEMS and related applications.