The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
Jun. 21, 2007
Jiung-yue Tien, Taichung County, TW;
Ming-te Tu, Taichung County, TW;
Chin-ching Huang, Taichung County, TW;
Jiung-Yue Tien, Taichung County, TW;
Ming-Te Tu, Taichung County, TW;
Chin-Ching Huang, Taichung County, TW;
Lingsen Precision Inductries, Ltd., T.E.P.Z. Taichung, TW;
Abstract
A cap package for MEMS includes a substrate having a connection zone that is grounded, a chip mounted on the substrate, a cap capped on the substrate and provided with a through hole corresponding to the chip, and a conducting glue made of a non-metal material having a resistivity smaller than 10Ωm. The conducting glue is applied on the connection zone of the substrate and sandwiched between the cap and the substrate for electrically connecting the cap with the substrate.