Company Filing History:
Years Active: 2015
Title: Innovations of Jiun-Chung Wang in Thermal Printhead Technology.
Introduction
Jiun-Chung Wang is an accomplished inventor based in Houston, TX (US). He has made significant contributions to the field of thermal printhead technology. His innovative designs and control circuits have the potential to enhance the performance and efficiency of printing systems.
Latest Patents
Wang holds a patent for a "Thick film print head structure and control circuit." This invention presents a new structure for a thick-film thermal printhead, along with various implementation approaches for controlling it. The design features a conductive lead at each end of the heater element that can be switched to either the power supply or ground, depending on the corresponding nib data bit. This improvement over traditional center-tap structures reduces the density of conductive leads, achieving better resolution of printed dots. Unlike previous printhead structures that suffered from undesirable leaking currents, Wang's design eliminates leakage current completely. The control of the thermal printhead is based on a sequential exclusive-OR (XOR) logic operation applied to the shifted-in nib data bit stream. This functionality can be incorporated into the driver IC, embedded in the raster data processing FPGA, or implemented as a lookup table in the main processor system's memory block.
Career Highlights
Wang is currently employed at Geospace Technologies Corporation, where he continues to innovate in the field of thermal printing technology. His work has garnered attention for its practical applications and advancements in printhead design.
Collaborations
Wang collaborates with notable colleagues, including Takeshi Toyosawa and Chung I Tan, who contribute to the development and refinement of his inventions.
Conclusion
Jiun-Chung Wang's contributions to thermal printhead technology exemplify the impact of innovative thinking in engineering. His patented designs and control circuits are paving the way for advancements in printing systems.
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