Company Filing History:
Years Active: 2008-2011
Title: Innovator Spotlight: Jir-shyr Chen
Introduction: Jir-shyr Chen, an accomplished inventor based in Beaverton, Oregon, has made significant contributions to the field of electrochemical deposition. With a total of two patents to his name, he is recognized for his innovative approaches in enhancing the efficiency and reliability of plating technologies.
Latest Patents: Jir-shyr Chen’s latest invention revolves around a method and apparatus that utilize cell voltage as a monitoring system for deposition coverage. This technology is particularly useful in preventing electrochemical deposition tools from malfunctioning, such as deplating wafers that exhibit poor or inadequate metal seed coverage, particularly in copper (Cu) applications. His patented methods involve measuring the voltage of a plating cell that contains a reference wafer with complete seed coverage and contrasting it to a calibration wafer lacking sufficient coverage. By assessing the reference and calibration resistances, an error trigger can be established, ensuring high-quality deposition processes.
Career Highlights: As a key member of Intel Corporation, Jir-shyr Chen has not only demonstrated his inventiveness through his patents but has also played a pivotal role in advancing the technologies employed in modern semiconductor manufacturing. His work contributes to the reliability of processes critical in the production of cutting-edge electronic devices.
Collaborations: Throughout his career, Jir-shyr Chen has collaborated with notable colleagues such as Yang Cao and Yue Ma. Their collective expertise and innovative spirit drive the success of their projects and contribute to Intel’s reputation as a leader in technological advancements.
Conclusion: Jir-shyr Chen exemplifies the spirit of innovation, combining practical solutions with a deep understanding of electrochemical processes. His work at Intel Corporation and his contributions to patent developments reflect the ongoing evolution of technology in the semiconductor field, paving the way for a more efficient future in electrochemical deposition.