Jinying Sun

Title: Jinying Sun: Innovator in Semiconductor Technology

Introduction

Jinying Sun is a notable inventor based in San Diego, California. He has made significant contributions to the field of semiconductor technology, particularly in the development of integrated circuit packages.

Latest Patents

Jinying Sun holds a patent for a semiconductor die that employs a repurposed seed layer for forming additional signal paths to the back end-of-line (BEOL) structure. This innovative approach allows for the coupling of under bump metallization (UBM) interconnects without the need for a coupled interconnect bump, thus creating an unraised interconnect bump. The selective removal of the seed layer during fabrication enables the coupling of UBM interconnects, enhancing the routing paths between raised interconnect bumps and the BEOL interconnect structure.

Career Highlights

Jinying Sun is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work focuses on advancing semiconductor technologies that improve the performance and efficiency of integrated circuits.

Collaborations

Throughout his career, Jinying has collaborated with talented individuals such as Yue Li and Durodami Joscelyn Lisk, contributing to various innovative projects in the semiconductor field.

Conclusion

Jinying Sun's contributions to semiconductor technology exemplify the importance of innovation in enhancing integrated circuit design and functionality. His work continues to influence the industry and pave the way for future advancements.