Qualcomm Incorporated

Jinying Sun

Yue Li

Durodami Joscelyn Lisk

A semiconductor die ('die') employing repurposed seed layer for forming additional signal paths to a back end-of-line (BEOL) structure of the die, and related integrated circuit (IC) packages and fabrication methods. A seed layer is repurposed that was disposed adjacent the BEOL interconnect structure to couple an under bump metallization (UBM) interconnect without a coupled interconnect bump thus forming an unraised interconnect bump, to a UBM interconnect that has a raised interconnect bump. To couple the unraised interconnect bump to the raised interconnect bump, the seed layer is selectively removed during fabrication to leave a portion of the seed layer repurposed that couples the UBM interconnect that does not have an interconnect bump to the UBM interconnect that has a raised interconnect bump. Additional routing paths can be provided between raised interconnect bumps to the BEOL interconnect structure through coupling of UBM interconnects to an unraised interconnect bump.

Semiconductor die employing repurposed seed layer for forming additional signal paths to back end-of-line (BEOL) structure, and related integrated circuit (IC) packages and fabrication methods

Growing community of inventors

San Diego, CA, United States of America

Jinying Sun