Jinho An

Title: Jinho An: Innovator in Die Stacking Technology

Introduction

Jinho An is a prominent inventor based in San Jose, CA (US). He has made significant contributions to the field of semiconductor technology, particularly in die stacking methods. His innovative approach has led to advancements that enhance the efficiency and performance of electronic devices.

Latest Patents

Jinho An holds a patent for a "Method of multi-layer die stacking with die-to-wafer bonding." This patent outlines a process that includes bonding multiple first dies to a substrate using a hybrid bonding technique. The method also involves selectively thinning the silicon of the bonded dies, passivating them for protection, and filling gaps with a specialized material to create a robust first layer. This innovative approach is crucial for improving the integration of semiconductor components.

Career Highlights

Jinho An is currently employed at Applied Materials, Inc., a leading company in the semiconductor manufacturing industry. His work focuses on developing advanced technologies that push the boundaries of what is possible in electronic design and manufacturing. His expertise in die stacking has positioned him as a key player in the field.

Collaborations

Throughout his career, Jinho has collaborated with notable colleagues, including Guan Huei See and Arvind Sundarrajan. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Jinho An's contributions to die stacking technology exemplify the spirit of innovation in the semiconductor industry. His patent and work at Applied Materials, Inc. highlight his commitment to advancing technology and improving electronic devices.