Company Filing History:
Years Active: 2001-2007
Title: Jingkun Fang: Innovator in Integrated Circuit Design
Introduction
Jingkun Fang is a notable inventor based in Santa Clara, CA, who has made significant contributions to the field of integrated circuit design. With a total of 3 patents to his name, Fang's work focuses on enhancing the reliability and performance of electronic circuits.
Latest Patents
One of Fang's latest patents is titled "Hot-carrier reliability design rule checker." This invention addresses methods for reliability simulations in aged circuits that have experienced degradation due to hot-carrier effects. The design rules on degradation can be incorporated into the netlist, allowing for thorough checks during the simulation process. The criteria for these design rules can vary based on device parameters, model card names, instance geometry, or temperature.
Another significant patent is "Apparatus and methods for modeling and simulating the effect of mismatch in design flows of integrated circuits." This method involves receiving measured data and an original model, extracting a mismatch model, and attaching it to the netlist for simulation. The process includes generating distributions of mismatch values and linking coefficients to create a comprehensive mismatch model.
Career Highlights
Fang has worked with Cadence Design Systems, Inc., where he has contributed to advancements in integrated circuit design and reliability. His expertise in the field has allowed him to develop innovative solutions that address critical challenges in circuit design.
Collaborations
Throughout his career, Fang has collaborated with notable professionals, including Lifeng Wu and Zhihong Liu. These collaborations have further enriched his work and contributed to the development of cutting-edge technologies in the industry.
Conclusion
Jingkun Fang's contributions to integrated circuit design through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of electronic circuit reliability and performance.