This inventor holds 4 USPTO granted patents. Top assignees: Freescale Semiconductor,inc., Motorola Corporation. Active years: 2003-2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Schaumburg, IL (US) (2003)
- Lake Zurich, IL (US) (2003 - 2004)
Company Filing History:
Years Active: 2003-2004
Title: Innovations by Inventor Jing Qi
Introduction
Jing Qi is an accomplished inventor based in Lake Zurich, IL (US), known for his contributions to the field of electrical engineering. With a total of 4 patents to his name, he has made significant advancements in the technology of area-array device assemblies and flip-chip assemblies.
Latest Patents
One of Jing Qi's latest patents is titled "Area-array device assembly with pre-applied underfill layers on printed wiring board." This invention provides a method for attaching an area-array device, such as a bumped flip chip, to an electrical substrate. The process involves applying an underfill material to a portion of the electrical substrate and heating it to a specific temperature. The bumped area-array device is then positioned adjacent to the underfill material, allowing for electrical connections through the connective bumps.
Another notable patent is "Flip-chip assembly with thin underfill and thick solder mask." This invention outlines a method for attaching a flip chip to an electrical substrate, where a thin layer of underfill material is applied to the active surface of the flip chip. The flip chip is then positioned on the substrate, which includes a thick layer of solder mask. Upon heating, the underfill material and solder mask combine to create a stress-relief layer, enhancing the reliability of the electrical connection.
Career Highlights
Jing Qi has worked with prominent companies in the technology sector, including Motorola Corporation and Freescale Semiconductor, Inc. His experience in these organizations has contributed to his expertise in developing innovative solutions in electrical engineering.
Collaborations
Throughout his career, Jing Qi has collaborated with talented professionals, including Janice M Danvir and Tomasz L Klosowiak. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Jing Qi's innovative work in the field of electrical engineering has resulted in several patents that enhance the functionality and reliability of electronic devices. His contributions continue to influence the industry and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile