The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2003

Filed:

Sep. 11, 2002
Applicant:
Inventors:

Jing Qi, Lake Zurich, IL (US);

Janice Danvir, Arlington Heights, IL (US);

Zhaojin Han, Lake Zurich, IL (US);

Prasanna Kulkarni, Schaumburg, IL (US);

Nadia Yala, Schaumburg, IL (US);

Robert Doot, Seattle, WA (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 3/300 ; H01L 2/976 ;
U.S. Cl.
CPC ...
H01L 3/300 ; H01L 2/976 ;
Abstract

A bumped semiconductor device ( ) exhibiting enhanced pattern recognition when illuminated in a machine vision system. The semiconductor device has a substantially coplanar array of solder bumps ( ) and a coating of underfill material ( ) on one face. A fluxing composition ( ) containing an image enhancing agent is selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps to cause the solder bumps to appear bright against the background of the underfill material when the semiconductor device is illuminated ( ) by selected wavelengths of light.


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