Jing-Ming Chiu

Title: The Innovative Contributions of Jing-Ming Chiu

Introduction

Jing-Ming Chiu is a notable inventor based in Hengshan, Taiwan. He has made significant contributions to the field of multi-chip packaging technology. His innovative work has led to the development of a patent that enhances the efficiency and functionality of electronic devices.

Latest Patents

Jing-Ming Chiu holds a patent for a multi-chip package. This invention features a first die pad with a chip attaching surface and an unoccupied surface, along with a second die pad that has similar characteristics. The connecting structures facilitate the connection between the two die pads. The design includes wire connecting surfaces that align with the chip attaching surfaces, allowing for efficient electrical connections between the chips. This innovative approach improves the overall performance of multi-chip packages.

Career Highlights

Chiu is associated with Macronix International Co., Ltd., a company known for its advancements in semiconductor technology. His work at Macronix has allowed him to focus on developing cutting-edge solutions in the electronics industry. His contributions have been instrumental in pushing the boundaries of multi-chip packaging.

Collaborations

Jing-Ming Chiu has collaborated with talented coworkers such as Jui-Chung Lee and Ji-Gang Lee. These collaborations have fostered an environment of innovation and creativity, leading to the successful development of new technologies.

Conclusion

Jing-Ming Chiu's work in multi-chip packaging exemplifies the spirit of innovation in the electronics field. His patent and contributions to Macronix International Co., Ltd. highlight his role as a key inventor in advancing technology.