The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2006
Filed:
Oct. 29, 2004
Jui-chung Lee, Touliu, TW;
Ji-gang Lee, Jhongpu Township, Chiayi County, TW;
Jing-ming Chiu, Hengshan Township, Hsinchu County, TW;
Jui-Chung Lee, Touliu, TW;
Ji-Gang Lee, Jhongpu Township, Chiayi County, TW;
Jing-Ming Chiu, Hengshan Township, Hsinchu County, TW;
Macronix International Co., Ltd., Hsinchu, TW;
Abstract
A multi-chip package is provided. A first die pad has a first chip attaching surface and a first unoccupied surface. A second die pad has a second chip attaching surface and a second unoccupied surface. The connecting structures are used for connecting the first die pad and the second die pad. The inner leads has wire connecting surfaces. The wire connecting surfaces, the first chip attaching surface and the second unoccupied surface face the same direction. A first chip has a first active surface and a first inactive surface. The first inactive surface is attached to the first chip attaching surface. A second chip has a second active surface and a second inactive surface. Part of the second active surface is attached to the second chip attaching surface. The wires are used for electrically connecting the first active surface and the second active surface to the wire connecting surfaces.