Company Filing History:
Years Active: 2019
Title: Innovations of Jing-Hua Cheng in Semiconductor Technology
Introduction
Jing-Hua Cheng is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent. His work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
Jing-Hua Cheng holds a patent for a semiconductor package and its manufacturing method. This invention includes a chip stack, at least one conductive wire, a first insulating encapsulant, a second insulating encapsulant, and a redistribution layer. The chip stack consists of semiconductor chips stacked on top of each other, with each chip featuring an active surface that has at least one bonding region. The conductive wire is strategically placed on the bonding region, while the first insulating encapsulant encapsulates both the bonding region and the conductive wire. Notably, a portion of each conductive wire remains exposed from the first insulating encapsulant. The second insulating encapsulant encapsulates the chip stack and the first insulating encapsulant, ensuring that the first insulating encapsulant is visible from the second insulating encapsulant. The redistribution layer is then positioned on both the first and second insulating encapsulants, establishing an electrical connection with the conductive wire.
Career Highlights
Jing-Hua Cheng is currently employed at Powertech Technology Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing semiconductor packaging technologies, which are crucial for modern electronic devices.
Collaborations
Jing-Hua Cheng collaborates with talented colleagues, including Kun-Yung Huang and Chi-Liang Pan. Their combined expertise contributes to the development of cutting-edge semiconductor solutions.
Conclusion
Jing-Hua Cheng's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work at Powertech Technology Inc. and collaborations with skilled professionals highlight the importance of teamwork in driving technological progress.