Jing-Cyuan Yang

Title: Jing-Cyuan Yang: Innovator in Embedded Package Carrier Technology

Introduction

Jing-Cyuan Yang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronics through his innovative patent. His work focuses on enhancing the manufacturing processes of electronic components, which is crucial in today's technology-driven world.

Latest Patents

Jing-Cyuan Yang holds a patent titled "Method of manufacturing a component embedded package carrier." This patent outlines a comprehensive manufacturing method that includes several key steps. The process begins with providing a dielectric layer, followed by the addition of a first and second copper foil layer. It involves forming a plurality of through holes and a conductive material layer on both copper foil layers. The method further details the patterning of these layers to define conductive through hole structures and patterned conductive layers. Additionally, it describes the incorporation of electronic components within the core layer, along with the lamination of insulating and circuit layers.

Career Highlights

Jing-Cyuan Yang is associated with Subtron Technology Co., Ltd., where he applies his expertise in developing advanced electronic packaging solutions. His innovative approach has positioned him as a key player in the industry, contributing to the advancement of manufacturing techniques.

Conclusion

Jing-Cyuan Yang's contributions to the field of embedded package carrier technology exemplify the importance of innovation in electronics manufacturing. His patent reflects a significant advancement that can enhance the efficiency and effectiveness of electronic component production.