This inventor holds 2 USPTO granted patents. Top assignee: United Test Center Inc.. Active years: 2001-2004.
Location History:
- Sanchung, TW (2001)
- Taipei, TW (2004)
Company Filing History:
Years Active: 2001-2004
Title: Jinchuan Bai: Innovator in Semiconductor Technology
Introduction
Jinchuan Bai is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to optically-sensitive devices.
Latest Patents
One of his latest patents is titled "Low profile optically-sensitive semiconductor package." This invention discloses a low-profile optically-sensitive semiconductor device that includes a substrate with an opening. A cover plate is bonded to the first surface of the substrate, allowing an optically-sensitive semiconductor chip to be adhered via the substrate's opening. After the semiconductor chip is electrically coupled to the substrate, a first encapsulant with a through hole connected to the substrate's opening is formed on the second surface. A sealing plate is then attached to the first encapsulant to hermetically separate the semiconductor chip from the atmosphere. Additionally, a second encapsulant is formed on the first surface of the substrate, ensuring that the ends of the conductive elements and the outer surface of the cover plate are exposed and flush with the top surface of the second encapsulant.
Another notable patent is "Low profile semiconductor package and process for making the same." This invention describes a low-profile semiconductor device that includes a substrate with a base layer formed with at least one hole and a plurality of conductive traces. A semiconductor die is attached to the base layer opposite the conductive traces and is electrically connected through first conductive elements passing through the hole. The semiconductor die is encapsulated by a first encapsulant, while a second encapsulant completely encapsulates the conductive traces, first conductive elements, and the hole, ensuring a robust and efficient design.
Career Highlights
Jinchuan Bai is currently employed at United Test Center Inc., where he continues to develop innovative semiconductor solutions. His work has significantly impacted the industry, particularly in enhancing the performance and reliability of semiconductor devices.
Collaborations
He collaborates with Chung-Che Tsai, contributing to advancements in semiconductor technology through their combined expertise.
Conclusion
Jinchuan Bai's contributions to semiconductor technology through his patents reflect his innovative spirit and dedication to advancing the field. His work at United Test Center Inc. continues to influence the development of cutting-edge semiconductor devices.