United Test Center Inc.

Jinchuan Bai

Chung-Che Tsai

A low-profile optically-sensitive semiconductor device is disclosed which includes a substrate with an opening. A cover plate is bonded to a first surface of the substrate in such a manner that a optically-sensitive semiconductor chip is adhered thereto via the opening of the substrate. Right after the semiconductor chip is electrically coupled to the substrate, a first encapsulant with a through hole connected with the opening of the substrate, is formed on the second surface of the substrate. A sealing plate is then attached to the first encapsulant to seal the through hole, so as to hermetically separate the semiconductor chip from the atmosphere. On the first surface of the substrate, a second encapsulant is formed such that ends of the conductive elements and an outer surface of the cover plate are exposed to and flush with a top surface of the second encapsulant.

Low profile optically-sensitive semiconductor package

A low-profile semiconductor device is disclosed which includes a substrate having a base layer formed with at least a hole and a plurality of conductive traces arranged on the base layer. A semiconductor die is attached to the base layer of the substrate opposite to the conductive traces and electrically connected to the conductive traces by a plurality of first conductive elements passing through the hole of the base layer. A plurality of second conductive elements are arrayedly connected to the terminal of each of the conductive traces for providing externally electrical connection to the semiconductor die. The semiconductor die is encapsulated by a first encapsulant formed on the surface of the substrate on which the semiconductor die is mounted. A second encapsulant is formed on the surface of the substrate on which the conductive traces are arranged to completely encapsulate the conductive traces, first conductive elements and the hole. Meanwhile, the second encapsulant is formed to encapsulate the second conductive elements in such a manner that the bottom ends of the second conductive elements are exposed to and flush with the bottom surface of the second encapsulant.

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Jinchuan Bai