This inventor holds 1 USPTO granted patent. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004
Title: Jin Zhu Lee and Integrated Circuit Package Testing.
Introduction
Jin Zhu Lee is an inventor associated with Kaohsiung, Taiwan, and Advanced Semiconductor Engineering, Inc. His patent work concerns testing integrated circuit packages.
Latest Patents
Lee is named on one patent, Test Assembly for Integrated Circuit Package. The invention describes a package substrate with contact pads connected in a daisy-chain pattern and a test board with its own daisy-chain-connected contact pads and test pads. The board’s contact pads are divided into groups, with each group connected to a pair of test pads and arranged in a line. The patent also describes a method for testing an integrated circuit package using the substrate and test board. Lee’s record includes 1 patent.
Career Highlights
Lee’s documented patent contribution focuses on an assembly and testing method for integrated circuit packages. The design organizes electrical contacts into groups to support package testing.
Collaborations
Lee’s listed coworkers include Po Jen Cheng and Heng Yu Kung. The available information identifies them as coworkers but does not specify their roles in the patent.
Conclusion
Jin Zhu Lee’s patent work addresses integrated circuit package testing through a structured arrangement of substrate and test-board contacts.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile