Jin-yang Lee

Title: Innovations of Jin-yang Lee in Semiconductor Technology

Introduction

Jin-yang Lee is a notable inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and manufacturing methods.

Latest Patents

One of Jin-yang Lee's key patents is titled "Stacked semiconductor module and method of manufacturing the same." This patent describes a stacked semiconductor module that includes a lower chip scale package (CSP) mounted on a module board, with an inverted upper CSP attached to the top of the lower CSP. This configuration forms a stacked semiconductor package, where the lower and upper CSPs are electrically connected to each other outside of the stacked semiconductor package. The electrical connection can be facilitated using the module board, and a conductive interconnection tape may be employed to connect the upper CSP to regions on the module board, which are in turn connected to the lower CSP.

Career Highlights

Jin-yang Lee is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to be at the forefront of semiconductor innovation, contributing to advancements that enhance the performance and efficiency of electronic devices.

Collaborations

Throughout his career, Jin-yang Lee has collaborated with talented individuals such as Joong-Hyun Baek and Yun-hyeok Im, who have also contributed to various projects in the semiconductor field.

Conclusion

Jin-yang Lee's innovative work in semiconductor technology, particularly his patent for a stacked semiconductor module, showcases his expertise and commitment to advancing the industry. His contributions continue to influence the development of modern electronic devices.