Yongin-si, South Korea

Jin Mo Kwon

USPTO Granted Patents = 1 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Jin Mo Kwon: Innovator in Semiconductor Technology

Introduction

Jin Mo Kwon is a notable inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

Jin Mo Kwon holds a patent for a semiconductor package and substrate for semiconductor packages. This invention includes a substrate with a semiconductor chip on one surface and a plurality of external connection terminals on the opposite surface. The substrate is designed with multiple wirings that electrically connect the semiconductor chip to the external terminals. Notably, the wiring configuration includes a first wiring with a portion that overlaps the edge of the semiconductor chip, enhancing the device's functionality.

Career Highlights

Kwon is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work focuses on advancing semiconductor packaging solutions, which are crucial for modern electronic devices.

Collaborations

Throughout his career, Jin Mo Kwon has collaborated with talented colleagues, including Dong Uk Kim and Jin Hee Hong. These partnerships have contributed to the development of innovative technologies in the semiconductor field.

Conclusion

Jin Mo Kwon's contributions to semiconductor technology through his patent and work at Samsung Electronics Co., Ltd. highlight his role as an influential inventor in the industry. His innovative designs continue to shape the future of electronic devices.

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