The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Feb. 02, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package includes a substrate; a semiconductor chip on a first surface of the substrate; and a plurality of external connection terminals on a second surface of the substrate that is opposite to the first surface. The substrate includes a plurality of wirings configured to electrically connect the semiconductor chip and the plurality of external connection terminals. The plurality of wirings includes a first wiring, and the first wiring includes a first portion and a second portion connected to each other, the second portion overlapping an edge of the semiconductor chip in a vertical direction that is perpendicular to the first surface of the substrate. A second width of the second portion is greater than a first width of the first portion.