Jin Kun Yoo

Title: Jin Kun Yoo and Semiconductor Packaging Innovation.

Introduction

Jin Kun Yoo is an inventor associated with Incheon, South Korea. The available information credits Yoo with 3 patents and identifies Amkor Technology Singapore Holding Pte. Ltd. as the company associated with Yoo’s work.

Latest Patents

One listed patent is titled “Electronic Devices with a Redistribution Layer and Methods of Manufacturing Electronic Devices with a Redistribution Layer.” The description presents an electronic device with a base substrate, an electronic component, an encapsulant, an interposer substrate, and a vertical interconnect linking conductive structures in the substrates. It also describes using a redistribution-layer substrate for one substrate and a laminate substrate for the other, alongside related manufacturing methods.

The supplied information lists this same patent title and description twice, so it is presented here as one distinct patent entry.

Career Highlights

Yoo’s listed patent work concerns semiconductor packaging, particularly electronic-device structures that combine redistribution-layer and laminate substrates. The disclosed design connects components across substrates through a vertical interconnect embedded in encapsulant.

Collaborations

The supplied information names Seung Nam Son and Dong Hyun Khim as coworkers associated with Yoo’s work. It does not specify their roles or the details of any joint patent contributions.

Conclusion

Jin Kun Yoo’s listed patent activity focuses on semiconductor packaging structures and manufacturing methods that integrate redistribution-layer technology with laminate substrates.