Hwaseong, South Korea

Jin-Chul Park

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jin-Chul Park. Retrieved from https://idiyas.com/inventor/jin-chul-park-xcj4c5q6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Jin-Chul Park: Innovator in Semiconductor Packaging

Introduction

Jin-Chul Park is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions.

Latest Patents

One of Jin-Chul Park's notable patents is for a package substrate and semiconductor package that includes a conductive plate and an insulating plate. This innovative semiconductor package features a mounting region and a peripheral region, along with at least one capillary channel in the peripheral region. The design incorporates a semiconductor chip mounted on the insulating plate and a molding member that covers the chip, with a portion of the molding member situated in the capillary channel. This patent highlights his ability to enhance semiconductor packaging technology.

Career Highlights

Jin-Chul Park is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to be at the forefront of technological advancements in semiconductor packaging.

Collaborations

Throughout his career, Jin-Chul Park has collaborated with talented individuals such as Kwang-Won Choi and Sang-Woo Pae. These collaborations have contributed to the development of innovative solutions in the semiconductor field.

Conclusion

Jin-Chul Park is a distinguished inventor whose work in semiconductor packaging has made a significant impact on the industry. His innovative designs and collaborations continue to drive advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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