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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10347576 B1

PDFFull Text
Date of Patent:
Jul. 09, 2019

Filed:

Sep. 20, 2017

Package substrate and semiconductor package including the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Kwang-Won Choi, Suwon-si, KR;

Sang-Woo Pae, Seongnam-si, KR;

Seong-Won Jeong, Suwon-si, KR;

Min-Jae Kwon, Seoul, KR;

Da-Hye Min, Gwacheon-si, KR;

Jin-Chul Park, Hwaseong-si, KR;

Jae-Won Chang, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:

Lee & Morse, P.C.

Primary Examiner:

Long Pham

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/053 (2006.01); H01L 23/13 (2006.01); H01L 23/20 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/16 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49855 (2013.01); H01L 23/053 (2013.01); H01L 23/13 (2013.01); H01L 23/16 (2013.01); H01L 23/20 (2013.01); H01L 23/24 (2013.01); H01L 23/315 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 21/565 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01);
Abstract

A semiconductor package includes a package substrate, the package substrate including a conductive plate, an insulating plate on the conductive plate, the insulating plate including a mounting region and a peripheral region surrounding the mounting region, and at least one capillary channel in the peripheral region, a semiconductor chip on the mounting region of the insulating plate, and a molding member on the insulating plate to cover the semiconductor chip, a portion of the molding member being in the at least one capillary channel.

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