Company Filing History:
Years Active: 2019
Title: Min-Jae Kwon: Innovator in Semiconductor Packaging
Introduction
Min-Jae Kwon is a prominent inventor based in Seoul, South Korea. He is known for his contributions to the field of semiconductor packaging, particularly through his innovative designs that enhance the functionality and efficiency of electronic devices. His work is instrumental in advancing technology in the semiconductor industry.
Latest Patents
Min-Jae Kwon holds a patent for a "Package substrate and semiconductor package including the same." This patent describes a semiconductor package that features a package substrate, which includes a conductive plate and an insulating plate. The insulating plate has a mounting region and a peripheral region surrounding it, along with at least one capillary channel in the peripheral region. The design incorporates a semiconductor chip mounted on the insulating plate and a molding member that covers the chip, with a portion of the molding member situated in the capillary channel. This innovative approach improves the performance and reliability of semiconductor packages.
Career Highlights
Min-Jae Kwon is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung allows him to work on cutting-edge technologies and contribute to the development of advanced semiconductor solutions. His expertise in semiconductor packaging has made him a valuable asset to the company.
Collaborations
Throughout his career, Min-Jae Kwon has collaborated with notable colleagues, including Kwang-Won Choi and Sang-Woo Pae. These collaborations have fostered innovation and have led to significant advancements in semiconductor technology.
Conclusion
Min-Jae Kwon is a key figure in the semiconductor industry, with a focus on innovative packaging solutions. His patent and work at Samsung Electronics Co., Ltd. highlight his commitment to advancing technology in this critical field. His contributions are paving the way for future developments in semiconductor packaging.