Da-Hye Min

Title: Da-Hye Min: Innovator in Semiconductor Packaging

Introduction

Da-Hye Min is a prominent inventor based in Gwacheon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit and technical expertise.

Latest Patents

Da-Hye Min holds a patent for a "Package substrate and semiconductor package including the same." This invention involves a semiconductor package that features a package substrate, which includes a conductive plate and an insulating plate. The insulating plate has a mounting region and a peripheral region, with at least one capillary channel in the peripheral region. A semiconductor chip is placed on the mounting region, and a molding member covers the chip, with part of the molding member situated in the capillary channel. This innovative design enhances the functionality and efficiency of semiconductor packages.

Career Highlights

Da-Hye Min is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to be at the forefront of semiconductor technology, contributing to advancements that impact various electronic devices.

Collaborations

Throughout his career, Da-Hye Min has collaborated with notable colleagues, including Kwang-Won Choi and Sang-Woo Pae. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Da-Hye Min's contributions to semiconductor packaging exemplify his dedication to innovation and excellence in technology. His patent and work at Samsung Electronics Co., Ltd. highlight his role as a key player in the advancement of semiconductor technology.