Jimmin Yao

Title: Jimmin Yao: Innovator in Semiconductor Packaging

Introduction

Jimmin Yao is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent related to backside metallization.

Latest Patents

Jimmin Yao holds a patent for "Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level." This patent encompasses semiconductor packages and methods to form these packages. The semiconductor package includes a plurality of first dies on a substrate, an interface layer over the first dies, and a backside metallization (BSM) layer directly on the interface layer. The BSM layer consists of first, second, and third conductive layers, with the first layer made of titanium, the second layer of nickel-vanadium, and the third layer comprising gold, silver, or copper materials. The design also includes a heat spreader over the BSM layer, enhancing the efficiency of the semiconductor package.

Career Highlights

Jimmin Yao is currently employed at Intel Corporation, where he continues to innovate in the semiconductor industry. His work focuses on improving the performance and reliability of semiconductor packages, which are crucial for modern electronic devices.

Collaborations

Throughout his career, Jimmin has collaborated with esteemed colleagues such as Chandra Mohan Jha and Prasad Ramanathan. These collaborations have furthered advancements in semiconductor technology and have contributed to the success of various projects at Intel Corporation.

Conclusion

Jimmin Yao's contributions to semiconductor packaging through his innovative patent demonstrate his expertise and commitment to advancing technology. His work at Intel Corporation and collaborations with fellow innovators highlight his significant role in the industry.