Jim Patterson

Title: Jim Patterson: Innovator in Conformal 3D Non-Planar Multi-Layer Circuitry

Introduction

Jim Patterson is a notable inventor based in Owego, NY (US). He has made significant contributions to the field of electronics, particularly in the development of advanced circuitry technologies. With a total of 5 patents to his name, Patterson's work has had a considerable impact on the industry.

Latest Patents

One of Patterson's latest patents is focused on conformal 3D non-planar multi-layer circuitry. This innovative method involves providing a substrate with a non-planar surface and depositing a first conformal dielectric layer that conforms to this surface. The process continues with the application of a first conformal circuitry layer on the dielectric layer. Additionally, a second conformal dielectric layer is deposited on the first circuitry layer, which also conforms to its non-planar surface. This method allows for the sequential deposition of successive layers, enhancing the functionality of the circuitry. Microvias are incorporated to provide electrical connections between the various circuit layers, further advancing the technology.

Career Highlights

Jim Patterson is currently employed at Lockheed Martin Corporation, where he continues to innovate and develop new technologies. His work at this prestigious company has allowed him to collaborate with other talented professionals in the field.

Collaborations

Patterson has worked alongside notable colleagues such as Stephen Gonya and Kenn Twigg. Their combined expertise has contributed to the success of various projects and innovations within the company.

Conclusion

Jim Patterson's contributions to the field of conformal 3D non-planar multi-layer circuitry exemplify his dedication to innovation. His work continues to influence the electronics industry, showcasing the importance of advanced circuitry technologies.